3D Systems’ MultiJet Printing (MJP) and Figure 4 technologies combined with Antleron’s bioengineering expertise lay foundation for groundbreaking bioprinting solutions with potential to improve personalized patient care.
STMicroelectronics has updated the TouchGFX user-interface software framework for STM32 microcontrollers, adding new features that enable smoother and more dynamic user interfaces and lower demand on the memory and CPU.
ABB is to acquire a majority stake of 67 percent in Shanghai Chargedot New Energy Technology Co., Ltd. (“Chargedot”), a leading Chinese e-mobility solution provider. The transaction is expected to be completed in the coming months and ABB has the possibility to increase its stake further in the next three years.
SICK has unveiled its second-generation of smart motor sensors supporting the revolutionary Hiperface DSL® single-cable feedback system for servo drives. The SICK EDS 35 singleturn and EDM 35 multiturn encoders achieve a step-change in resolution and dynamic performance.
Global engineering technologies company Renishaw heads to Formnext in Frankfurt, Germany, to showcase how additive manufacturing (AM) is being used by different industries to optimise component manufacture.
During the visit by India’s Defense Minister Shri Rajnath Singh to our Villaroche facility near Paris, Safran Aircraft Engines CEO Olivier Andriès reiterated the importance of the close ties of unity between our company and India in the civil and military sectors.
Power management company Eaton today announced it has proven in regulatory test cycles and real-world use its cylinder-deactivation (CDA) technology can play a key role in helping commercial vehicle manufacturers meet or exceed 2024 and 2027 U.S. emissions regulations.