24 {{ "2026-08-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-24T00:00:00+00:00" | date "longDate" }}

Kaynes Technology India Limited

Bosgame Enters India with Kaynes Technology; Companies Sign Strategic MoU to Strengthen Computing Presence in India

Collaboration brings together BOSGAME’s intelligent computing portfolio with Kaynes Technology’s engineering, manufacturing and market execution capabilities.

Read more…

24 {{ "2026-08-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-24T00:00:00+00:00" | date "longDate" }}

NEC Corporation News

Osaka University and NEC Construct RED-ONION Data Transfer Platform

RED-ONION is a dedicated high-speed data transfer platform engineered to transport sensitive scientific research data between campus research facilities and high-performance computing centers.

Read more…

24 {{ "2026-08-24T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-24T00:00:00+00:00" | date "longDate" }}

Dunkermotoren News

Dunkermotoren Introduces Configurable BLDC Motor Solutions for Pumps

Dunkermotoren has introduced configurable brushless DC (BLDC) motor platforms designed to improve efficiency, precise flow delivery, and digital connectivity for OEM pump manufacturers.

Read more…

21 {{ "2026-08-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-21T00:00:00+00:00" | date "longDate" }}

Congatec News

congatec & EFCO Expand Partnership for Customized Embedded Systems in APAC

aReady.YOURS combines congatec computing platforms with EFCO’s system design and manufacturing expertise for industrial automation OEMs.

Read more…

21 {{ "2026-08-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-21T00:00:00+00:00" | date "longDate" }}

Hitachi News

Hitachi High-Tech & Powrex Optimize Battery Cathode Coating with Physical AI

The collaboration combines coating expertise, process data and process informatics to identify optimal conditions for all-solid-state battery manufacturing.

Read more…

21 {{ "2026-08-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-21T00:00:00+00:00" | date "longDate" }}

Toshiba News

Toshiba 300 kV SF6-Free Breaker Selected by TEPCO Power Grid

TEPCO Power Grid has selected Toshiba Corporation's 300 kV natural-origin gas circuit breaker and gas-insulated bus for grid installation.

Read more…

21 {{ "2026-08-21T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-21T00:00:00+00:00" | date "longDate" }}

Rohm Semiconductors News

ROHM to Showcase Mobility and Industrial Solutions at electronica India 2026

ROHM Semiconductor presents power conversion reference designs, electric vehicle solutions, and edge AI technologies at electronica India 2026.

Read more…

20 {{ "2026-08-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-20T00:00:00+00:00" | date "longDate" }}

Yokogawa News

Yokogawa Releases CT500SA and CT200SA Split Core Current Sensors

Yokogawa Test & Measurement Corporation introduces the CT500SA and CT200SA AC/DC split core current sensors for high-accuracy power and waveform testing.

Read more…

20 {{ "2026-08-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-20T00:00:00+00:00" | date "longDate" }}

TDK News

TDK Launches SensEI edgeRX PRO Predictive Maintenance Sensor Node

Designed for harsh industrial environments, edgeRX PRO enables long-term monitoring with up to 10 years of battery life.

Read more…

20 {{ "2026-08-20T00:00:00+00:00" | date "MMM" }} '26

Written on {{ "2026-08-20T00:00:00+00:00" | date "longDate" }}

ASRockInd News

ASRock Industrial Earns SL3 Cybersecurity Certification

The iEP-5010G-DCN is the first SL3-certified Host Device industrial computer for critical OT environments.

Read more…

Collaboration brings together BOSGAME’s intelligent computing portfolio with Kaynes Technology’s engineering, manufacturing and market execution capabilities.

RED-ONION is a dedicated high-speed data transfer platform engineered to transport sensitive scientific research data between campus research facilities and high-performance computing centers.

Dunkermotoren has introduced configurable brushless DC (BLDC) motor platforms designed to improve efficiency, precise flow delivery, and digital connectivity for OEM pump manufacturers.

aReady.YOURS combines congatec computing platforms with EFCO’s system design and manufacturing expertise for industrial automation OEMs.

The collaboration combines coating expertise, process data and process informatics to identify optimal conditions for all-solid-state battery manufacturing.

TEPCO Power Grid has selected Toshiba Corporation's 300 kV natural-origin gas circuit breaker and gas-insulated bus for grid installation.

ROHM Semiconductor presents power conversion reference designs, electric vehicle solutions, and edge AI technologies at electronica India 2026.

Yokogawa Test & Measurement Corporation introduces the CT500SA and CT200SA AC/DC split core current sensors for high-accuracy power and waveform testing.

Designed for harsh industrial environments, edgeRX PRO enables long-term monitoring with up to 10 years of battery life.

The iEP-5010G-DCN is the first SL3-certified Host Device industrial computer for critical OT environments.

International