02 {{ "2023-03-02T00:00:00+00:00" | date "MMM" }} '23

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Telit News

TELIT CINTERION EXPANDS 5G LPWA MODULE PORTFOLIO

The new ultra-compact 5G low-power wireless access (LPWA) modules will feature Sony’s Altair ALT1350 chipset.

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01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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wieland-electric News

WIELAND ELECTRIC PRESENTS NEW EMERGENCY STOP BUTTONS WITH M12 CONNECTION

The new emergency stop buttons M12 connection can be easily integrated into plants and systems using pre-assembled M12 standard cables.

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01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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NEC Corporation News

QUALCOMM AND NEC FURTHER THE COMMERCIALIZATION OF VIRTUALIZED AND OPEN RAN

New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm^® X100 5G RAN Accelerator Card. Qualcomm^® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Parker News

Parker Introduces New Catalogue Featuring Bestobell Cryogenic Valves for Industrial Gas Applications

Parker Hannifin has launched a new comprehensive catalogue detailing its range of Bestobell high-performance cryogenic valves used in applications for the transportation, storage, and processing of ultra-low temperature liquefied gases.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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PEI-Genesis News

Shield your customers from global supply issues

PEI-Genesis advises on how to provide stability for customers during uncertain times.

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01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Moxa News

Futureproof Mobile Automation with Moxa Next-Generation Industrial Wi-Fi Access Points/Clients

Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Advantech News

Advantech: Demonstrating AI at the cutting 'Edge' of embedded technologies

The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA^® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.

Read more…

01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Rohde & Schwarz

Embedded world 2023: Rohde & Schwarz showcases its state-of-the-art test solutions for embedded systems

Embedded systems are at the core of today’s electronic devices, whether in consumer electronics, telecommunications, industrial, medical, automotive or aerospace applications. Flawless operation is crucial, and engineers face complex challenges when designing ever more compact embedded systems which meet today’s demands of efficiency, safety, reliability and interoperability. Rohde & Schwarz addresses these challenges with its wide-ranging test and measurement solutions showcased at the embedded world Exhibition & Conference 2023 in Nuremberg.

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01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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RÖSBERG Engineering GmbH

Plant Documentation 4.0 – an essential enabler for Industry 4.0

Specialist articles on Industry 4.0 generally emphasize the aspect of technical feasibility of the consistent, intelligent networking of machines, processes and personnel: What gateways, protocols and platforms will be needed to interlink machines from different manufacturers? What legal requirements have to be observed? How can security be designed to avoid hacker attacks?.

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01 {{ "2023-03-01T00:00:00+00:00" | date "MMM" }} '23

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Binder News

BINDER - PROTECTED COMPREHENSIVELY AGAINST CORROSION

Sensor technology in the process industry is often exposed to humid, aggressive environments. In industries such as food or pharmaceuticals production, but also in medical applications, it is therefore often necessary to protect certain components against corrosion.

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Technical Articles

ROHM’s New ±1% Accuracy Current Sense Amplifier ICs Reduce Mounting Area by Approx. 46% Over Conventional Configurations

TELIT CINTERION EXPANDS 5G LPWA MODULE PORTFOLIO

The new ultra-compact 5G low-power wireless access (LPWA) modules will feature Sony’s Altair ALT1350 chipset.

WIELAND ELECTRIC PRESENTS NEW EMERGENCY STOP BUTTONS WITH M12 CONNECTION

The new emergency stop buttons M12 connection can be easily integrated into plants and systems using pre-assembled M12 standard cables.

QUALCOMM AND NEC FURTHER THE COMMERCIALIZATION OF VIRTUALIZED AND OPEN RAN

New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm^® X100 5G RAN Accelerator Card. Qualcomm^® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.

Parker Introduces New Catalogue Featuring Bestobell Cryogenic Valves for Industrial Gas Applications

Parker Hannifin has launched a new comprehensive catalogue detailing its range of Bestobell high-performance cryogenic valves used in applications for the transportation, storage, and processing of ultra-low temperature liquefied gases.

Shield your customers from global supply issues

PEI-Genesis advises on how to provide stability for customers during uncertain times.

Futureproof Mobile Automation with Moxa Next-Generation Industrial Wi-Fi Access Points/Clients

Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.

Advantech: Demonstrating AI at the cutting 'Edge' of embedded technologies

The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA^® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.

Embedded world 2023: Rohde & Schwarz showcases its state-of-the-art test solutions for embedded systems

Plant Documentation 4.0 – an essential enabler for Industry 4.0

BINDER - PROTECTED COMPREHENSIVELY AGAINST CORROSION

Sensor technology in the process industry is often exposed to humid, aggressive environments. In industries such as food or pharmaceuticals production, but also in medical applications, it is therefore often necessary to protect certain components against corrosion.

International

Technical Articles

The new ultra-compact 5G low-power wireless access (LPWA) modules will feature Sony’s Altair ALT1350 chipset.

The new emergency stop buttons M12 connection can be easily integrated into plants and systems using pre-assembled M12 standard cables.

New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm® X100 5G RAN Accelerator Card. Qualcomm® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.

Parker Hannifin has launched a new comprehensive catalogue detailing its range of Bestobell high-performance cryogenic valves used in applications for the transportation, storage, and processing of ultra-low temperature liquefied gases.

PEI-Genesis advises on how to provide stability for customers during uncertain times.

Moxa has introduced its AWK Series, a new lineup of next-generation industrial wireless networking solutions offering 802.11ac Gigabit Wi-Fi, IEC 62443-4-2 SL2 certified* security, and dual-band Turbo Roaming for unmatched wireless reliability and availability.

The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.

Sensor technology in the process industry is often exposed to humid, aggressive environments. In industries such as food or pharmaceuticals production, but also in medical applications, it is therefore often necessary to protect certain components against corrosion.

International

New NEC virtualized distributed unit (vDU) solution to incorporate the Qualcomm^® X100 5G RAN Accelerator Card. Qualcomm^® 5G RAN Platforms will provide high performance, energy-efficiency, and low latency for NEC products.

The Advantech AIR-030, an ultra-compact Edge AI system powered by the NVIDIA^® Jetson Orin module series, will take centre stage at Embedded World 2023 in Hall 3, Booth 339.