Temperature profiling and analysis solutions for reflow applications

Datapaq at enova exhibition in Paris

Figure: Datapaq develops and manufactures temperature profiling solutions especially adapted to reflow applications

Cambridge, UK – At the 2014 enova exhibition in Paris, Datapaq (stand K41) will present temperature profiling solutions for all kinds of reflow soldering processes, including wave, vapor phase, and selective soldering as well as reworking. Based on robust data loggers and application-specific thermal barriers, Reflow Tracker systems pass through SMT processes along with the printed circuit boards, compiling detailed temperature profiles and, if required, providing data for real-time monitoring via radio. The systems help reduce reject rates and increase yield. The accompanying Easy Oven Setup (EOS) software automatically determines the optimal oven recipe for specific products or manufacturing equipment, rendering consecutive test runs unnecessary and thereby saving considerable time and effort.

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