Atlas Copco Showcases Compressed-Air Solutions at SEMICON India

Atlas Copco will present its advanced compressed-air solutions tailored for semiconductor manufacturing at SEMICON India 2026, held from September 17 to 19 at Yashobhoomi (IICC) in New Delhi. As India enters a manufacturing-led growth phase with increasing investments in fabs, packaging, and testing facilities, the demand for highly reliable, contamination-free utility infrastructure is surging.

At Booth 1637 in Hall 1, Atlas Copco will showcase an integrated air treatment and compression system. The setup includes the ZH oil-free centrifugal compressor, the MDG heat-of-compression dryer, advanced fine filtration, and the Optimizer 4.0 intelligent control system. Together, these technologies deliver the clean, dry, oil-free, and reliable compressed air essential for sensitive semiconductor applications such as purging, tool cooling, and automated instrumentation. Bhavin Pandya, General Manager of the Compressor Technique Customer Center at Atlas Copco India, emphasized that purity, consistency, and uninterrupted performance are vital to supporting the country's next generation of electronics plants.

Additional Context
This section provides technological and market background not explicitly detailed in the original release.

In semiconductor fabrication, Clean Dry Air (CDA) is an absolutely critical utility. Even microscopic traces of oil vapor, moisture, or particulate matter in the compressed air supply can contaminate silicon wafers during sorting, packaging, or etching, leading to massive yield losses. To guarantee this level of purity and achieve ISO 8573-1 Class 0 certification, modern fabs rely on 100% oil-free centrifugal compressors, such as Atlas Copco's ZH series. Furthermore, traditional desiccant air dryers typically consume significant amounts of electrical energy or purge air to regenerate their drying beds. The MDG rotary drum dryer circumvents this energy drain by recovering and utilizing the heat naturally generated in the compression process to regenerate the desiccant. By combining this thermal recovery with intelligent control systems, semiconductor plants can maintain the ultra-low dew points required for delicate wafer handling while drastically reducing the overall energy footprint of their utility operations.

Edited by Lekshman Ramdas, Induportals editor – adapted by AI.

www.atlascopco.com