13
'19
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Nicolás Correa News
13
'19
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SCHUNK News
Gripping systems are designed for collaborative, intelligent and intuitive operation
"We are experiencing a fundamental change in industrial production towards smart, intelligent processes – from initial planning and configuration, including commissioning and as ongoing operation and maintenance," Henrik A. Schunk, Managing Partner and CEO of gripping system and clamping technology specialist SCHUNK stressed at the end of the SPS 2019.
13
'19
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Dunkermotoren News
BG 66 DMOVE - NOW EVEN MORE POWER IN SIZE 65MM
At some point the limits of physics are reached. But until then the motto is: Optimize as long as it makes economic sense!.
13
'19
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Mouser News
Mouser Electronics Now Stocking Analog Devices ADRF5545A RF Front End for Massive MIMO Designs
Mouser Electronics the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the ADRF5545A RF front end module from Analog Devices, Inc.
13
'19
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ST News
STM8 Nucleo Boards
The highly affordable Nucleo boards allow anyone to try out new ideas and to quickly create prototypes with any STM8 MCU.
13
'19
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Emerson News
Emerson Releases New Magnetic Slurry Sensor and Transmitter Designed to Help Customers Cut Through the Noise
Flow measurement solution helps improve product quality, reduce raw material cost and minimize waste and re-work.
12
'19
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VOLVO CE News
Volvo Group Venture Capital invests in Autotech Ventures
Volvo Group Venture Capital AB has invested in Autotech Ventures - a leading American venture capital fund focusing on start-ups in the ground transportation sector.
12
'19
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Molex News
Molex Recognized by Autonomous Vehicle Technology Magazine for Innovative Telematic Control Unit Antenna Fusion
Solution enables high-quality vehicle connectivity.
12
'19
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Mouser News
InvenSense MOD_CH101 and DK-CH101 Ultrasonic Time-of-Flight Sensor Solutions
Mouser Electronics, the authorized global distributor with the newest semiconductors and electronic components, is now stocking the MOD_CH101 ultrasonic time-of-flight (ToF) sensor module and DK-CH101 SmartSonic™ platform from InvenSense, a TDK Group company.
12
'19
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Toshiba News
