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Case studies

VIETNAM’S NATIONAL INNOVATION CENTER RUNS ON ABB SMART BUILDING TECHNOLOGY

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18  '21
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Sany News

SANY’s 5.0 MW onshore wind turbine gets DNV approval

Recently, SANY RENEWABLE ENERGY’s 5.0 MW onshore wind turbine was granted a certificate issued by DNV, an international certification authority, making SANY the first internationally certified whole-machine manufacturer of large MW wind turbines in China.

18  '21
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Rohde & Schwarz

Rohde & Schwarz validates 10 Gbps end-to-end (E2E) peak downlink IP data throughput

Rohde & Schwarz announced today the next breakthrough in 5G data performance: With support of Qualcomm Technologies, Inc., Rohde & Schwarz has validated 10 Gbps end-to-end (E2E) IP data performance using its R&S CMX500 5G radio communication tester platform. The setup was powered by Snapdragon® X65 5G Modem-RF System, the world’s first 3GPP Release 16 modem-RF system with Qualcomm® QTM545 mmWave Antenna Module.

18  '21
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Exel Composites News

Exel Composites and Kineco Group announce a joint venture in Goa-India

A joint venture between the Kineco Group and Exel Composites creates a new composites design, engineering, and production company focused on serving the Indian market with pultruded composite solutions.

18  '21
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Bunting europe News

Bunting at Ecomondo

With the Ecomondo Green Technology Expo encompassing the circular economy, the Bunting stand (hall A2 stand 007) focuses on material recycling through material and metal separation to neodymium magnet recovery.

16  '21
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Phoenix Contact News

THR PCB terminal blocks up to 2.5 mm²

Phoenix Contact is extending its range of reflow-solder-capable PCB terminal blocks (MSL1) to include the 2.5 mm² cross-section.

16  '21
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AT&S News

AT&S continues to invest in its Leoben site

In view of the ongoing boom in demand in the microelectronics sector and ever-new performance requirements for electronic systems, AT&S has decided to put an even stronger focus on research and development. Therefore, the company is investing in a new R&D center for substrate and packaging solutions for the global semiconductor industry at its location in Leoben-Hinterberg. In addition, another technology upgrade of the production facilities will be implemented.

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