STMicroelectronics Boosts Sustainability with Toa Payoh Chiller Cooling

STMicroelectronics has appointed Singapore Power (SP Group) to upgrade its cooling infrastructure at the Toa Payoh site, which serves as a critical hub for ST’s packaging R&D and wafer testing operations. This new system will improve energy efficiency and aims to reduce carbon emissions by approximately 2,140 tons annually.

“Following the landmark agreement with SP Group in 2022 to implement Singapore’s largest industrial district cooling system at our operations in AMK TechnoPark, the upgrade to the cooling system in our Toa Payoh site demonstrates ST’s continued commitment to innovative cooling solutions and to become carbon neutral by 2027,” said Jean-Louis Champseix, Group VP, Head of Sustainability at STMicroelectronics. “With cooling accounting for a large proportion of our site’s overall energy consumption, the improved efficiency of this new system will further reduce our carbon footprint while ensuring we meet Singapore’s MEES regulations.”

With a cooling capacity of up to 3,200 refrigerant tons (RT), the new cooling system’s dual-temperature capability supplies both low and medium temperature cooling directly, eliminating the need for heat exchangers currently used to produce medium temperature cooling. It is designed to support all facility needs, saving up to five Gigawatt-hours of energy annually, equivalent to powering over 1,100 four-room HDB households a year.

Under the agreement, SP Group will design, build, operate, and maintain the new chiller cooling system, providing chilled-water-as-a-service on a 20-year contract. The construction and implementation phases are expected to be completed by December 2025. The upgrade aligns with the National Environment Agency’s (NEA) Minimum Energy Efficiency Standards (MEES) , which comes into effect in December 2025, and aligned with the strong sustainability agenda of the Singapore government, particularly the SG Green Plan 2030.

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