High-Performance Interconnect Solutions for Digital Infrastructure

Samtec, a global leader in high-performance interconnect solutions, successfully participated in electronica India 2026, held from 16–18 September 2026 in Bengaluru, bringing together engineers, technology leaders, customers, partners and innovators from across the electronics industry.

At the event, Samtec showcased a broad portfolio of advanced interconnect technologies designed to support next-generation applications across high-speed computing, artificial intelligence, telecommunications, data centers, automotive, industrial, aerospace and defence, RF, and optical systems.

Technology in Action
A major focus of Samtec’s presence at electronica India was giving visitors the opportunity to experience technology beyond the product display. The booth featured live demonstrations and technical discussions highlighting Samtec’s capabilities in high-speed signal integrity, RF, optical connectivity and high-density interconnect systems.

Key technologies and demonstrations included:

Demo:

1. 112G Front-Panel I/O Solutions
2. 56G Flyover and Backplane Solutions
3. Commercial- and Space-Grade Optical Interconnect Solutions
4. 110G RF Product Display

Product Display:

1. High-Speed Board-to-Board and Cable Systems
2. Precision RF Solutions
3. Optical Interconnect Technologies
4. Rugged and Power Interconnect Solutions
5. Automotive Interconnect Solutions

Samtec engineers and specialists were available throughout the exhibition to discuss specific design challenges and help visitors explore interconnect solutions suited to demanding applications.

Strengthening Connections with India’s Engineering Community
India continues to grow as an important center for electronics design, engineering, R&D and technology development. Samtec’s participation in electronica India reflects its continued focus on engaging more closely with engineers, customers, distributors, technology partners and the wider electronics ecosystem in the country.

The event also provided an opportunity for Samtec’s India and global teams to connect directly with customers and gain deeper insights into evolving requirements across key technology sectors.

“Electronica India gives us an excellent platform to engage directly with the engineering community and understand the challenges designers are solving today,” said Ashutosh Agarwal, Country Manager – India, Samtec. “For us, the exhibition is not simply about displaying products. It is about having meaningful technical conversations, demonstrating what our technologies can do, and building relationships that help engineers move their designs forward.”

Engineering the Next Generation of Connectivity
As systems become faster, smaller and more complex, interconnect performance is becoming increasingly critical to overall system design. Samtec continues to invest in technologies spanning high-speed electrical, precision RF, optics, flexible stacking, rugged/power and micro interconnect solutions, supported by engineering expertise and signal integrity capabilities.

Through its growing engagement in India—including technical sessions, customer Tech Days, roadshows, engineering content and industry collaborations—Samtec aims to make its technology and technical expertise increasingly accessible to India’s engineering community.




Edited by Maria Brueva, Induportals editor.

www.samtec.com