Advanced Microelectronics Architecture and Component Solutions for Industrial Systems

Kyocera Asia Pacific Pte. Ltd. designs, manufactures, and integrates advanced ceramic and electronic materials across consumer, industrial, and automotive applications. The organisation will present its operational portfolio of advanced semiconductor packages, automotive display architectures, passive electronic components, and precision machining systems at Electronica India 2026.

The trade event is scheduled for September 16 to September 18, 2026, at the Bangalore International Exhibition Centre in Bengaluru, Karnataka, India, positioned in Hall 3, Booth F45. The demonstration encompasses component integration for electric vehicles, advanced driver-assistance sys tems, high-performance computing, smart telemetry, space exploration, and wireless communication infrastructure. Yohei Fukuda, Managing Director of the Kyocera Asia Pacific Group, delivers a keynote during the CEO Forum at Cassia Hall on September 16, detailing technological roadmaps relevant to regional infrastructure.

High-Density Semiconductor Packaging and Flip-Chip Substrates
Kyocera addresses high-performance computing and artificial intelligence requirements through organic package substrates, specifically Flip-Chip Ball Grid Array (FCBGA) and Thin Core FCBGA platforms.

These organic substrates support high interconnect densities required by server central processing units, hardware accelerators, optical communication devices, and re-timer integrated circuits. By minimizing core thickness, Thin Core FCBGA structures reduce signal transfer delay and parasitics across high-frequency interfaces. Complementing organic options, Kyocera provides multilayer ceramic packaging and substrates engineered for thermal dissipation and structural stability in satellite electronics and automotive electronic control units.

Passive Component Architectures for Power and Telemetry
Component arrays targeting automotive electrification include multilayer ceramic capacitors (MLCCs), polymer tantalum capacitors, and metal-oxide varistors designed for high-temperature operating margins in electric vehicle battery management and safety systems.

For smart metering and regional internet of things infrastructure, the company exhibits low-leakage supercapacitors, embedded antennas, and micro-pitch board-to-board connectors engineered for minimal quiescent draw. Aerospace applications utilize qualified passive arrays compliant with European Space Components Coordination (ESCC) and NASA technical standards, alongside wet tantalum capacitors and oven-controlled crystal oscillators (OCXOs) for high-stability clock generation. High-frequency wireless installations utilize surface acoustic wave (SAW) filters, radio-frequency antennas, and discrete timing crystals supporting standalone Fifth Generation (5G) networks and edge computing interfaces. Renewable energy conversions are managed through film capacitors and high-capacitance supercapacitors deployed in industrial power conditioning.

Automotive Vision Systems and Non-Contact Display Technology
In vehicle sensing, Kyocera integrates automotive camera assemblies with high-dynamic-range imaging and embedded processing chips tailored to robotic autonomy and advanced driver-assistance architectures.

The demonstration includes an interactive Aerial Display platform. The system generates mid-air floating visual images through high-efficiency curved mirrors that collimate and focus projected light. Integrated non-contact optical sensor arrays detect physical gestures in real space, removing the requirement for physical surface contact while preserving optical clarity and lowering power consumption compared to conventional diffused projection systems. Manufacturing support is represented by precision circuit tools, such as micro-diameter drills, printed circuit board routers, countersinks, and scoring tools suited for dense multilayer substrate machining.

Additional Context:
This section details technical specifications and competitive benchmarking not included in the original product announcement

Kyocera's FCBGA substrates compete in high-performance computing interconnects against architectures produced by Ibiden Co., Ltd. and Shinko Electric Industries Co., Ltd. Ibiden specializes in ultra-high-layer-count Ajinomoto Build-up Film (ABF) substrates with line-and-space dimensions reaching below 5/5 micrometres, serving flagship graphics processing units and data center central processing units. Shinko Electric Industries utilizes high-density multi-layer organic flip-chip packages with embedded silicon bridge architectures to optimize cross-die communication. Kyocera positions its Thin Core FCBGA packages to balance layer count with reduced thermal expansion mismatch and parasitic inductance, targeting optical networking transceivers and intermediate-tier accelerator dies.

In mid-air projection, Kyocera's curved-mirror Aerial Display benchmarks against retroreflective plate systems, such as Asukanet Co., Ltd.'s ASKA3D optical plates. ASKA3D plates rely on orthogonal micro-mirror arrays that form real images from light passing directly through a flat glass or plastic beam splitter. While planar retroreflective plates simplify spatial casing, Kyocera's curved-mirror geometry redirects and focuses light vectors to deliver higher luminous transmission and contrast efficiency directly from compact internal display sources, though it requires specific concave mechanical housings to house the optical depth.

Edited by Natania Lyngdoh, Induportals editor, assisted by AI.

www.kyocera.com