Precious Metal Materials for Semiconductor Manufacturing
Tanaka Precious Metal Technologies presents semiconductor materials and recycling solutions to support sustainable manufacturing at SEMICON Southeast Asia 2026 in Malaysia.
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Semiconductor fabrication relies on high-purity materials with controlled electrical conductivity, thermal performance, and mechanical stability. The adoption of silicon carbide (SiC) and gallium nitride (GaN) devices increases demands on die-attach materials, interconnections, and thermal management systems.
TANAKA’s approach combines alloy engineering, precision metallurgy, and surface treatment processes. In parallel, the company integrates recycling technologies to recover precious metals such as gold, silver, palladium, and ruthenium, supporting a circular supply chain and reducing dependence on primary extraction.
Material Technologies and Functional Characteristics
Bonding and Interconnection Materials
Bonding wires composed of gold (Au), silver (Ag), copper (Cu), and palladium-coated copper (PCC) are designed for stable electrical connections. Controlled surface morphology and dimensional tolerances ensure consistent bonding performance under thermal cycling and high-current conditions.
Silver Sintering Paste
Silver sintering paste is used as a die-attach material with thermal conductivity exceeding 200 W/m·K. This enables efficient heat dissipation and mechanical stability in high-power semiconductor devices.
AgSn TLP Bonding Sheets
Transient liquid phase (TLP) bonding sheets enable diffusion-based joining with bonding strengths up to 50 MPa. The material supports large chip sizes up to 20 mm and eliminates the use of lead, meeting environmental compliance requirements.
Thin Film Deposition Materials
Sputtering targets and precursors for chemical vapor deposition (CVD) and atomic layer deposition (ALD) enable controlled thin-film formation. Ruthenium-based precursors support low-resistivity conductive layers with resistance to electromigration in advanced device structures.
Probe Pin Materials
Probe pin materials based on palladium, copper, iridium, and rhodium alloys are engineered for high wear resistance and electrical conductivity. Proprietary materials such as TK-SK achieve hardness up to 640 HV, extending durability in high-cycle semiconductor testing environments.
Circular Economy Integration
TANAKA’s recycling system combines collection, refining, and remanufacturing processes. Chemical separation and purification methods enable recovery of high-purity metals suitable for reuse in semiconductor applications.
This closed-loop approach reduces material loss, stabilizes supply availability, and lowers environmental impact by minimizing the need for primary raw material extraction.
Deployment and Industrial Context
The technologies are presented at SEMICON Southeast Asia 2026, held from May 5 to 7 in Kuala Lumpur, Malaysia. The exhibition reflects regional demand for semiconductor manufacturing expansion across Malaysia and ASEAN.
TANAKA supports this ecosystem through local operations that provide material supply, technical support, and recycling services. The integration of advanced materials with recycling infrastructure contributes to process stability, thermal efficiency, and resource optimization in semiconductor production systems.
Edited by an industrial journalist, Lekshman Ramdas, with AI assistance.
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